This second edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. The handbook explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. It covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.